Spectroscopy provides quality in-line or at-line control measurements via contactless, non-destructive measurements of wafers.
Thousands of our systems are used to control dry etching processes (plasma end-point detection) or inspect layer thickness (ellipsometry). Sophisticated fitting algorithms enable calculation of the layer thickness down to the nanometer scale. Fast, reliable high-sensitivity data acquisition systems by tec5USA guarantee minimum measurement times for high sample throughput.
Further applications include wet etching process monitoring via concentration measurements or material analysis by Raman spectroscopy.